IC Packaging


Once the product is designed & ready for manufacturing production, ISE Europe guides customers through the engineering/production phases, covering most of the available products in the market, such as:

  • QFN
  • BGA
  • SOP
  • Discrete
  • QFP
  • CSP
  • Bumping
  • Flip Chip
  • SIP Module

There are many things that we need to keep in mind from a manufacturing prospective. Engineering resource, BOM, logistics, IT system, forecast and capacity allocation are only a few examples, and any mistake here might cause unpleasant production issues.

To avoid this, ISE Europe will work closely with customers to ensure a smooth production flow.


ISE Europe provides all kind of test solutions for both wafer test and final test covering all different market applications: Digital, Mixed Signal and RF devices. The test engineering team provide full support during the development of customer's solutions following all test requirements. Test solutions include:

Wafer Sort

- High-Speed and Temperature Wafer testing
- Temperature Control Probing and Cold Probing
- From 6'' to 12''
- Wafer Mapping and Inking

Final Test

- Multiple Sites testing
- Handlers: Seiko/Epson, Delta Flex, Synax, etc.

Test platforms
  • Verigy
  • Teradyne
  • Credence
  • Advantest
  • LTX
  • Inovys